Gaya APA

Eswaran, S. et al. (2018). Engineering a better future :interplay between engineering, social sciences, and innovation . Cham, Switzerland: Springer Open.

Gaya MLA

Subrahmanian, Eswaran. et al. "Engineering a better future :interplay between engineering, social sciences, and innovation". Cham, Switzerland: Springer Open, 2018. Electronic Resource.